Micron Technology, Inc.

MU

Micron Technology, Inc.

Quarterly revenue, EPS, free cash flow, valuation, and Rule of 40 scores for Micron Technology, Inc..

R40: 388 · 2026 Q3 $1.06T
$935.39
News

Coverage

News

China's Largest Memory Maker Earned a 49% Margin. It Is Profiting From the Memory Cycle.

CXMT's IPO prospectus is the first hard number: CNY 50.8bn of revenue in the March quarter at a 49% net margin — a company inside the price spike, not under it.

R40
News

Cerebras Shipped a 132GB Wafer-Scale Inference Machine Without HBM. Its Models Need 50,000.

Cerebras' CS-4 proves inference silicon can skip HBM: 750 PFLOPS and no high-bandwidth memory. But its 132 GB of SRAM faces models needing 25,000-100,000 GB.

R40
News

SK hynix Approved ₩54T of Fabs Before a ₩40T Buyback. That Is Not Capacity Discipline.

SK hynix's ₩40T buyback reads as capacity discipline — but its board approved ₩54.3T of fabs on August 7, and that capacity lands in 2028, the bear-case year.

R40
News

Micron's Rule of 40 Swung From −884 to 388. The Same Metric Failed at Both Ends.

Micron's gross margin ran from −32.66% to 84.56% in fourteen quarters. A score built on year-over-year growth reads whatever the price cycle was doing.

R40
News

Micron's HBM Gross Margin Rose From 37.7% to 84.6%. The Cyclical Thesis Is Broken.

In February we argued Micron's sold-out HBM capacity made it look more like a foundry than a commodity memory maker, then cited that call again in July without ever checking it. The quarter ended 2026-05-28 answers it: revenue up 4.46× year over year while cost of goods rose 10.5%. Our own series stops one quarter short of all of it.

R40
News

Micron Just Sold Out Its Entire 2026 HBM Capacity

Micron's HBM4 enters volume production ahead of schedule, 2026 capacity is 100% sold out, and the stock hit a record $410. Here's what it means for the AI memory race.

R40

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Open MU Rule of 40 details
Median 81.8 Above 40 0–40 Below 0
97
2024 Q4
85
Q1
37
Q2
55
Q3
47
2025 Q4
79
Q1
219
Q2
388
2026 Q3 40 0 Mix
ANALYST RATINGS
Strong Buy $1507
Consensus as of Jul 30, 2026
MU
Susquehanna Positive $2,000
Reiterated
2026-06-25
Wedbush Outperform $1,400
Reiterated
2026-06-24
Citigroup Buy $1,200
Reiterated
2026-06-18
Morgan Stanley Overweight $1,050
Reiterated
2026-06-16

See all 4 ratings →

Forward model

Where the revenue goes next

MU FORWARD MODEL $706.33 -24%
Earnings coverage

Latest earnings

See all MU earnings → Investor relations →

Background

Company History

Exchange
NASDAQ
IPO Date
Jun 1, 1984
Shares Outstanding
1.14B
1984
IPO and Public Listing

Micron goes public on NASDAQ amid early DRAM leadership (world

2005
IM Flash JV with Intel and Lexar Acquisition

Strong entry into NAND flash market, diversifying beyond DRAM and positioning for mobile/storage growth.

2013
Acquisition of Elpida Memory and Rexchip

Major DRAM industry consolidation amid bankruptcy opportunities; elevates Micron to top-tier supplier, enhances pricing discipline, and sparks stock recovery from post-financial crisis lows.

2015
3D NAND and 3D XPoint Breakthroughs

Shift to vertical stacking technology enables higher densities/lower costs; new non-volatile category challenges traditional storage paradigms.

2022
$100B+ US Fab Investment Announcements

Backed by CHIPS Act subsidies, commits to massive domestic expansion in New York/Idaho, shifting narrative to long-term US manufacturing leadership.

2023
Industry-First HBM3E Sampling for AI

Positions Micron as key supplier for Nvidia/AMD AI GPUs; ignites multi-year HBM demand surge, marking entry into high-margin AI memory market.

2024
HBM Production Ramp and Supply Sell-Outs

Ships leading HBM3E/HBM4, exits consumer graphics to prioritize AI; demand vastly outstrips supply, driving 200%+ stock gains and debates over end of traditional boom-bust cycles.

Leadership

Key Players

Sanjay Mehrotra
President & CEO
Sanjay Mehrotra
CEO since 2017, previously co-founded SanDisk. Leading Micron through AI-driven memory demand surge.

The CEO view — 10 podcasts, interviews & articles →

Mark Murphy
EVP & CFO
CFO since 2018, previously at Qorvo and TE Connectivity. Managing capital allocation amid cyclical industry.
Sumit Sadana
EVP & Chief Business Officer
Oversees business units and corporate strategy. Driving HBM (High Bandwidth Memory) growth for AI.
Scott DeBoer
EVP, Technology & Products
Leads R&D and manufacturing. Key to maintaining technology leadership in DRAM and NAND.
Robert Switz
Chairman of the Board Board
Chairman since 2012, former CEO of ADC Telecommunications.
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